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Sinic‑TEK S8080L

Sinic‑TEK S8080L SPI is an inline automatic 3D solder paste inspection machine. Using laser‑based 3D measurement technology, it inspects solder paste thickness, volume, area, bridging and voids after stencil printing to control soldering quality at source. Widely used in consumer electronics, industrial control, automotive electronics and new‑energy production lines.

Core Specifications

PCB Size: 50×70mm～600×510mm, Thickness 0.5–6.0mm

Inspection Accuracy: XY 10μm, Z‑axis thickness 1μm, Min pad 0201

3D Imaging: Multi‑group blue light high‑speed 3D scanning, supports double‑sided inspection

Machine Dimension: W1020×D1420×H1680mm, Weight approx. 880kg

Power & Air: AC220V 1.8kVA, Air pressure 0.45–0.55MPa

Inspection Items: Solder paste thickness, volume, area, bridging, insufficient/excess paste, offset, voids

Key Features

Supports extra‑large PCBs up to 600×510mm

3D quantitative measurement with traceable data for automotive quality standards

AI‑powered algorithm ensures low false‑alarm rate for fine‑pitch pads

Real‑time SPC data analysis for closed‑loop printing quality control

High cost‑performance with low maintenance cost

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