Bruce: +86 138 2336 0271
Kitty: +86 199 0157 8421

bruce@smtfdh.com
tanqian@smtfdh.com

Home / Products / SPI

Koh Young KY‑8030‑3‑3D

Koh Young KY‑8030‑3‑3D is a new‑generation flagship True‑3D SPI, upgraded from 8030‑2. Adopting 3rd‑generation moiré interferometry technology, it features higher precision, faster speed and stronger anti‑interference performance, widely used in automotive electronics, medical devices, servers and new‑energy industries.

Core Specifications

PCB Size: Single‑lane max. 510×510mm, Dual‑lane 510×320mm, Thickness 0.4–6mm

Inspection Accuracy: XY 6μm, Z‑axis 0.3μm, compatible with 01005 ultra‑fine pads & 0.25mm fine pitch

3D Technology: 3rd‑generation multi‑view True‑3D moiré imaging, shadow‑free inspection

Inspection Items: Solder paste thickness, volume, area, bridging, insufficient/excess paste, voids, slump and contamination

Machine Dimension: W1180×D1460×H1690mm, Weight approx. 1080kg

Power & Air: AC220V, Air pressure 0.5MPa

Key Features

3rd‑generation shadow‑free True‑3D technology for fine‑pitch and complex pads

Ultra‑high quantitative precision complying with IATF16949 & IPC‑610 standards

AI‑enhanced algorithm with low false‑alarm rate for high‑density PCBs

Closed‑loop quality control via real‑time SPC big‑data analysis

High‑rigidity structure for stable 24/7 mass production

Get a Quote Email

You May Also Like